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MLG2.0 single chip solution for 100G networks

TeraSquare to unveil new reverse gearbox IC at ECOC

CANNES, September 24, 2014

Korea-based TeraSquare, a leader in fabless semiconductor development, is set to reveal its MLG2.0 single chip solution for 100G networks, at this year’s ECOC exhibition, a leading European optical communications event.

The new IC is the first for the market and will revolutionise the industry by enabling 10GE and 40GE channels to be used at 100G data rates, while improving signal quality and making massive power consumption savings, said a statement.
 
The MLG2.0 is a reverse gearbox for CDR applications that converts up to ten 10GE channels or a combination of 10GE and 40GE channels up to 100G, it said.

It is designed for next-generation 100G small form factor modules such as CFP2, CPF4 and QSFP28 and is fully compliant to OIF. The IC only consumes 1.4 watt (W) of power and has all of the features of the TeraSquare 100G parallel CDR launched last year, it said.

Upgrading to 100Gbps data-rate is progressing rapidly within the market, as well as a big increase in the number of ports using legacy data-rate 10GE and 40GE. These rates are set to be widely used for the next 10 years, leaving the market with a huge demand in solutions that can support the legacy data-rate at 100Gbps data rate with increasing port density, said the statement.

MLG2.0 is the right solution for this demand that is set to hit the market. TeraSquare is already working on the future beyond MLG2.0, MLG3.0 is currently being standardised and will include a forward-error-correction (FEC) function.

Jinho Park, CEO, said: “We are very excited to be exhibiting at ECOC again this year and once again bringing to the market our new product. We expect samples to be ready for evaluation by the end of this year and in full production during 2015.

“TeraSquare is a proven company providing low power and highly integrated 100G solutions using a low power CMOS design platform. We believe this platform is a few years ahead of other competitors’ technologies and reflects our position in the market and will build on the success we have currently been seeing with some of the tier 1 telecom players.” - TradeArabia News Service




Tags: Exhibition | Chip | Solution | single |

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