First invisible heat sink DRAM module launched
Dubai, August 26, 2010
Golden Systems Middle East, a leading distributor of IT products, has launched the world’s first invisible heat sink DRAM module, the Kingmax DDR3 2200MHz with Nano Thermal Dissipation Technology, in the Middle East region.
The new Kingmax DDR3 2200MHz memory module, which presents the best efficiency running at the highest bandwidth up to 17.6GB/s, allows more data input and increases the system operating capability, is a perfect fit for enthusiasts, gamers and bench-markers, said a statement.
Currently, Kingmax applies the technology onto its overclocking Hercules series including 1600MHz, 2000MHz and 2200MHz.
“The new Kingmax DDR3 2200MHz is a breakthrough in technology. It is the first DRAM module adopted Nano Thermal Dissipation technology (which is named “invisible heat sink”) in the world. Nano Thermal Dissipation Technology utilizes nano-sized silicon and DLC (diamond-like-carbon) compound as the medium to increase the release of radiant heat. With Kingmax’s advanced packing technology to integrate the material onto the chips, it shows great effect to pull the heat from the surface at a faster rate than the normal heat sink. By adopting the invisible heat sink, it provides superior heat dissipation effect to boost overclocking performance and stability of the system,” said Gloria Choy, product manager at Golden System Middle East.
“Compared to the normal heat sink, which usually equips on the DRAM module, the Kingmax DDR3 2200 MHz has the advantage of compact size which improves the air flow inside the case. The no power request design also offers an economical operating environment, as well as compact product and package design reduces extra waste and transportation to green the environment,” Choy added.
KINGMAX Group is the world’s first RAM/memory card module manufacturer that features vertical industrial integration capabilities and solid R&D capability and innovative cutting-edge patented technology. – TradeArabia News Service
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