Cray and Intel Corp have signed a multi-year agreement to develop future supercomputing technologies

The collaboration of the two industry leaders will result in advance high-performance computing (HPC) systems that will help solve some of the world’s most complex scientific, engineering and humanitarian challenges, the companies said in a joint statement.

“We’re excited at the potential of bringing together Intel’s powerful silicon expertise and Cray’s industry leadership in scalable HPC systems,” said Cray president and chief executive officer Peter Ungaro.

“We pride ourselves in offering the most innovative supercomputing systems and our customers will now enjoy greater choice in processor technologies,” he said.

“This collaboration provides the HPC market segment with access to the best microprocessors the industry has to offer at any point in time, in the most advanced supercomputers in the world,” Ungaro added.

“This further strengthens Cray’s industry-leading adaptive supercomputing vision as we move into the Cascade timeframe and beyond.”

The two companies plan to explore future supercomputer component designs such as multi-core processing and advanced interconnects. As a result of this collaboration, Cray and Intel plan to develop a range of HPC systems and technologies over the next several years.

“Cray’s commitment to Intel is a testament of our commitment to HPC and the strength of our hardware and software roadmap and many-core research,” said Patrick Gelsinger, senior vice president and general manager of Intel’s Digital Enterprise Group.

“Throughout Cray’s history, it has been an innovator in high-end HPC while Intel has pushed the boundaries of processor technology.

“The combination of this industry leadership and technical strength will allow HPC users to take advantage of future Xeon and other Intel processor technologies,” Gelsinger said. “Together we will enable fundamental and historical problems of science and industry to be solved.” – TradeArabia News Service